Skip to main content

HDI PCB Industry Report 2020: Global Technology Landscape, Trends and Opportunities – Yahoo Finance

<p class="canvas-atom canvas-text Mb(1.0em) Mb(0)–sm Mt(0.8em)–sm" type="text" content="DUBLIN, June 18, 2020 /PRNewswire/ — The "Technology Landscape, Trends and Opportunities in the Global HDI PCB Market" report has been added to ResearchAndMarkets.com’s offering.” data-reactid=”12″>DUBLIN, June 18, 2020 /PRNewswire/ — The “Technology Landscape, Trends and Opportunities in the Global HDI PCB Market” report has been added to ResearchAndMarkets.com’s offering.

Research and Markets LogoResearch and Markets Logo
Research and Markets Logo

<p class="canvas-atom canvas-text Mb(1.0em) Mb(0)–sm Mt(0.8em)–sm" type="text" content="The technologies in HDI PCB market have undergone significant change in recent years, traditional low density to advance high density PCBs. The rising wave of new technologies, such as 10+ layer technology are creating significant potential in smartphone, tablets, and automotive applications, and driving the demand for HDI PCB technologies.

In HDI PCB market, various technologies, such as 4-6 layers, 8-10 layers, and 10+ layers are used in various applications. Growth in consumer electronics, miniaturization of electronic devices, increasing demand for high performance PCBs, and growing adoption of advanced electronics and safety measures in the automotive are creating new opportunities for various HDI PCB technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the HDI PCB market. Some of the companies profiled in this report include Siemens AG, Compeq Manufacturing Co. Ltd., TTM Technologies, Inc., Unimicron, AT&amp;S, Ibiden Group, SEMCO, Unitech Printed Circuit Board Corp., Tripod Technology Corp., DAP Corporation, and Meiko Electronics Co. Ltd

The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global HDI PCB technology by application, technology, and region.

This report answers the following 9 key questions:

Q.1 What are some of the most promising and high-growth technology opportunities for the HDI PCB market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in HDI PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in HDI PCB market?
Q.6 What are the latest developments in HDI PCB technologies? Which companies are leading these developments?
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this HDI PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this HDI PCB technology space?

Key Topics Covered

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in HDI PCB Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts Analysis from 2013-2024
4.1. HDI PCB Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. 4-6 Layer
4.2.2. 8-10 Layer
4.2.3. 10+ Layer
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Smartphone and Tablets
4.3.1.1. 4-6 Layer
4.3.1.2. 8-10 Layer
4.3.1.3. 10+ Layer
4.3.2. Telecom/Datacom
4.3.2.1. 4-6 Layer
4.3.2.2. 8-10 Layer
4.3.2.3. 10+ Layer
4.3.3. Computer
4.3.3.1. 4-6 Layer
4.3.3.2. 8-10 Layer
4.3.3.3. 10+ Layer
4.3.4. Consumer Electronics
4.3.4.1. 4-6 Layer
4.3.4.2. 8-10 Layer
4.3.4.3. 10+ Layer
4.3.5. Automotive
4.3.5.1. 4-6 Layer
4.3.5.2. 8-10 Layer
4.3.5.3. 10+ Layer

5. Technology Opportunities (2013-2024) by Region
5.1. HDI PCB Market by Region
5.2. North American HDI PCB Technology Market
5.2.1. Canadian HDI PCB Technology Market
5.2.2. Mexican HDI PCB Technology Market
5.3. European HDI PCB Technology Market
5.3.1. German HDI PCB Technology Market
5.3.2. French HDI PCB Technology Market
5.4. APAC HDI PCB Technology Market
5.4.1. Chinese HDI PCB Technology Market
5.4.2. Japanese HDI PCB Technology Market
5.4.3. Indian HDI PCB Technology Market
5.4.4. South Korean HDI PCB Technology Market
5.5. RoW HDI PCB Technology Market

6. Latest Developments and Innovations in the HDI PCB Technologies

7. Companies/Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the HDI PCB Market by Technology
8.2.2. Growth Opportunities for the HDI PCB Market by Application
8.2.3. Growth Opportunities for the HDI PCB Market by Region
8.3. Emerging Trends in the HDI PCB Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the HDI PCB Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the HDI PCB Market

9. Company Profiles of Leading Players
9.1. Siemens AG
9.2. Compeq Manufacturing Co. Ltd.
9.3. TTM Technologies, Inc.
9.4. Unimicron
9.5. AT&amp;S
9.6. Ibiden Group
9.7. SEMCO
9.8. Unitech Printed Circuit Board Corp.
9.9. Tripod Technology Corp.
9.10. DAP Corporation
9.11. Meiko Electronics Co. Ltd.

For more information about this report visit https://www.researchandmarkets.com/r/8xmeb4” data-reactid=”24″>The technologies in HDI PCB market have undergone significant change in recent years, traditional low density to advance high density PCBs. The rising wave of new technologies, such as 10+ layer technology are creating significant potential in smartphone, tablets, and automotive applications, and driving the demand for HDI PCB technologies.

In HDI PCB market, various technologies, such as 4-6 layers, 8-10 layers, and 10+ layers are used in various applications. Growth in consumer electronics, miniaturization of electronic devices, increasing demand for high performance PCBs, and growing adoption of advanced electronics and safety measures in the automotive are creating new opportunities for various HDI PCB technologies.

This report analyzes technology maturity, degree of disruption, competitive intensity, market potential, and other parameters of various technologies in the HDI PCB market. Some of the companies profiled in this report include Siemens AG, Compeq Manufacturing Co. Ltd., TTM Technologies, Inc., Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Board Corp., Tripod Technology Corp., DAP Corporation, and Meiko Electronics Co. Ltd

The study includes technology readiness, competitive intensity, regulatory compliance, disruption potential, trends, forecasts and strategic implications for the global HDI PCB technology by application, technology, and region.

This report answers the following 9 key questions:

Q.1 What are some of the most promising and high-growth technology opportunities for the HDI PCB market?
Q.2 Which technology will grow at a faster pace and why?
Q.3 What are the key factors affecting dynamics of different technologies? What are the drivers and challenges of these technologies in HDI PCB market?
Q.4 What are the levels of technology readiness, competitive intensity and regulatory compliance in this technology space?
Q.5 What are the business risks and threats to these technologies in HDI PCB market?
Q.6 What are the latest developments in HDI PCB technologies? Which companies are leading these developments?
Q.7 Which technologies have potential of disruption in this market?
Q.8 Who are the major players in this HDI PCB market? What strategic initiatives are being implemented by key players for business growth?
Q.9 What are strategic growth opportunities in this HDI PCB technology space?

Key Topics Covered

1. Executive Summary

2. Technology Landscape
2.1. Technology Background and Evolution
2.2. Technology and Application Mapping
2.3. Supply Chain

3. Technology Readiness
3.1. Technology Commercialization and Readiness
3.2. Drivers and Challenges in HDI PCB Technologies
3.3. Competitive Intensity
3.4. Regulatory Compliance

4. Technology Trends and Forecasts Analysis from 2013-2024
4.1. HDI PCB Opportunity
4.2. Technology Trends (2013-2018) and Forecasts (2019-2024)
4.2.1. 4-6 Layer
4.2.2. 8-10 Layer
4.2.3. 10+ Layer
4.3. Technology Trends (2013-2018) and Forecasts (2019-2024) by Application Segments
4.3.1. Smartphone and Tablets
4.3.1.1. 4-6 Layer
4.3.1.2. 8-10 Layer
4.3.1.3. 10+ Layer
4.3.2. Telecom/Datacom
4.3.2.1. 4-6 Layer
4.3.2.2. 8-10 Layer
4.3.2.3. 10+ Layer
4.3.3. Computer
4.3.3.1. 4-6 Layer
4.3.3.2. 8-10 Layer
4.3.3.3. 10+ Layer
4.3.4. Consumer Electronics
4.3.4.1. 4-6 Layer
4.3.4.2. 8-10 Layer
4.3.4.3. 10+ Layer
4.3.5. Automotive
4.3.5.1. 4-6 Layer
4.3.5.2. 8-10 Layer
4.3.5.3. 10+ Layer

5. Technology Opportunities (2013-2024) by Region
5.1. HDI PCB Market by Region
5.2. North American HDI PCB Technology Market
5.2.1. Canadian HDI PCB Technology Market
5.2.2. Mexican HDI PCB Technology Market
5.3. European HDI PCB Technology Market
5.3.1. German HDI PCB Technology Market
5.3.2. French HDI PCB Technology Market
5.4. APAC HDI PCB Technology Market
5.4.1. Chinese HDI PCB Technology Market
5.4.2. Japanese HDI PCB Technology Market
5.4.3. Indian HDI PCB Technology Market
5.4.4. South Korean HDI PCB Technology Market
5.5. RoW HDI PCB Technology Market

6. Latest Developments and Innovations in the HDI PCB Technologies

7. Companies/Ecosystem
7.1. Product Portfolio Analysis
7.2. Market Share Analysis
7.3. Geographical Reach

8. Strategic Implications
8.1. Implications
8.2. Growth Opportunity Analysis
8.2.1. Growth Opportunities for the HDI PCB Market by Technology
8.2.2. Growth Opportunities for the HDI PCB Market by Application
8.2.3. Growth Opportunities for the HDI PCB Market by Region
8.3. Emerging Trends in the HDI PCB Market
8.4. Disruption Potential
8.5. Strategic Analysis
8.5.1. New Product Development
8.5.2. Capacity Expansion of the HDI PCB Market
8.5.3. Mergers, Acquisitions, and Joint Ventures in the HDI PCB Market

9. Company Profiles of Leading Players
9.1. Siemens AG
9.2. Compeq Manufacturing Co. Ltd.
9.3. TTM Technologies, Inc.
9.4. Unimicron
9.5. AT&S
9.6. Ibiden Group
9.7. SEMCO
9.8. Unitech Printed Circuit Board Corp.
9.9. Tripod Technology Corp.
9.10. DAP Corporation
9.11. Meiko Electronics Co. Ltd.

For more information about this report visit https://www.researchandmarkets.com/r/8xmeb4



from WordPress https://ift.tt/2YNyVog
via IFTTT
Labels:

Comments

Post a Comment

Popular posts from this blog

Rufus Wainwright to Perform New Album at Livestream Concert – Rolling Stone

Gearing up for the release of his new album Unfollow the Rules, Rufus Wainwright will perform the record in its entirety at a livestream concert on Saturday. The performance will take place in the ballroom at Paramour Mansion in Los Angeles, previously owned by the silent film star Antonio Moreno. Wainwright will perform on acoustic guitar — similar to his recent In My Room  segment — accompanied by piano, guitar and a string section. The livestream will premiere in Germany and France here , later to be available on demand for 90 days. A stream will be available in the U.S. on All Arts ‘ Facebook page, premiering at 2 pm E.T. “The Paramour Session will show a completely different side of Unfollow the Rules ,” Wainwright said in a statement. “Acoustic, stripped back, sparser, but in a Rufus Wainwrightian sense of course. Good songs can survive in many different environments. I want my fans to have an opportunity to hear the music live when the album comes out. The only w...
Post a Comment
Read more

Future shocks: 17 technology predictions for 2025 – World Economic Forum

We asked our 2020 intake of Technology Pioneers for their views on how technology will change the world in the next five years. From quantum computers and 5G in action to managing cancer chronically, here are their predictions for our near-term future. "lazy", :class=>"", :alt=>""}” use_picture=”true”> Image: Getty Images/iStockphoto 1. AI-optimized manufacturing Paper and pencil tracking, luck, significant global travel and opaque supply chains are part of today’s status quo, resulting in large amounts of wasted energy, materials and time. Accelerated in part by the long-term shutdown of international and regional travel by COVID-19, companies that design and build products will rapidly adopt cloud-based technologies to aggregate, intelligently transform, and contextually present product and process data from manufacturing lines throughout their supply chains. By 2025, this ubiquitous stream of data and the intelligent algorithms ...
Post a Comment
Read more

Work From Home Opens New Remote Insider Threats – Threatpost

The administrator of your personal data will be Threatpost, Inc., 500 Unicorn Park, Woburn, MA 01801. Detailed information on the processing of personal data can be found in the privacy policy . In addition, you will find them in the message confirming the subscription to the newsletter. from WordPress https://ift.tt/2Vbs7zI via IFTTT
Post a Comment
Read more